Monday, September 20, 2010

US Patent 7795725 - Carbon nanostructure mat for thermal cooling

There has been much academic and some industry interest in the use of carbon nanostructures to form channels for future transistors. However, more near term applications in electronics may depend on the thermal cooling advantages offered by carbon nanostructures to semiconductor packaging. This latest patent from Micron Technology follows other companies including Intel and Hon Hai Precision in teaching a way to use carbon nanotubes to cool semiconductor dies. Claim 1 reads: 

1. A semiconductor package, comprising:

a semiconductor die;

a thermally conductive material in thermal contact with the die and comprising carbon nanostructures; and

wherein the semiconductor die has a substantially planar backside surface; and

wherein the thermally conductive material is a mat of the carbon nanostructures extending across an entirety of said substantially planar backside surface.