US Patent 7791194 - Nanotube composite interconnect

http://ip.com/patent/US7791194

This patent is from a company called Oracle America and teaches using the electrical and thermal conductivity of carbon nanotubes to enhance interconnects used in printed circuit board (PCB) assemblies. Claim 1 reads:
1. A composite interconnect system comprising:

a plurality of carbon nanotubes;

a plurality of solder balls; and

a plurality of standoff balls;

wherein each of the plurality of carbon nanotubes, solder balls, and standoff balls are disposed on a first device to provide a connection to a second device.