US Patent 7453154 - CNT via flip chip interconnect

http://www.freepatentsonline.com/7453154.html

This patent from Delphi Technologies teaches forming the via connections between electronic circuit substrates with carbon nanotubes. Claim 1 reads:

1. An electronic package comprising:

a first electronic device including an electronic circuit having an input/output pad, and at least one electrically conductive carbon nanotube extending from the input/output pad and beyond a surface of the device to provide an interconnect;

a second electronic device, the first electronic device mounted on the second electronic device to form a stacked arrangement;

a substrate, the stacked arrangement mounted on the substrate, the carbon nanotube extending away from the first electronic device, through an opening in the second electronic device, and connected to the substrate.