Monday, November 24, 2008

US Patent 7453093 - CNT filler for LED package

This patent from Samsung teaches using the thermal transport properties of carbon nanotubes to improve heat dissipation in LED packaging. Claim 1 reads:

1. A light emitting diode package comprising:

a substrate having at least one groove formed on an underside surface thereof;

a plurality of upper electrodes formed on a top surface of the substrate;

at least one light emitting diode chip mounted over the substrate, the light emitting diode chip having both terminals electrically connected to the upper electrodes; and

a carbon nanotube filler filled in the groove of the substrate.