US Patent 7534648 - Thermally stable nanotube substrate material

http://www.freepatentsonline.com/7534648.html

Based on Intel's patents thermal management of integrated circuits seems to be their most pressing issue requiring nanomaterials. This latest patent continues this trend teaching a high thermal conductivity and low thermal expansion IC substrate material formed by intersecting nanofibers or nanotubes combined with alumina or silica nanoparticles. Claim 1 reads:

1. A method of forming a composite material, comprising:

disposing at least a first arrangement including a plurality of approximately aligned nanofilaments and at least a second arrangement including a plurality of approximately aligned nanofilaments as at least one array at a surface of a substrate, the nanofilaments of the second arrangement being approximately perpendicular to and approximately coplanar with the nanofilaments of the first arrangement, at least one nanofilament of the second arrangement crossing over at least one nanofilament of the first arrangement;

dispersing a plurality of nanoparticles in a resin;

disposing the resin among arrangements of the array; and

curing the resin.