US Patent 8187955 - Graphene growth on a carbon-containing semiconductor layer
http://www.freepatentsonline.com/8187955.html
This patent from IBM teaches growing graphene films on 200mm or 300mm silicon wafers using a double annealing process. Claim 1 reads:
1. A method of forming a graphene layer including at least one graphene monolayer, said method comprising:
forming a semiconductor-carbon alloy layer comprising a material other than crystalline silicon carbide on a semiconductor substrate;
converting said semiconductor-carbon alloy layer into a semiconductor carbide layer by a first anneal; and
converting an exposed top portion of said semiconductor carbide layer into a graphene layer including at least one graphene monolayer by a second anneal.
This patent from IBM teaches growing graphene films on 200mm or 300mm silicon wafers using a double annealing process. Claim 1 reads:
1. A method of forming a graphene layer including at least one graphene monolayer, said method comprising:
forming a semiconductor-carbon alloy layer comprising a material other than crystalline silicon carbide on a semiconductor substrate;
converting said semiconductor-carbon alloy layer into a semiconductor carbide layer by a first anneal; and
converting an exposed top portion of said semiconductor carbide layer into a graphene layer including at least one graphene monolayer by a second anneal.
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