US Patent 8102063 - Pad structure with nanostructured coating film
http://www.freepatentsonline.com/8102063.html
This patent from Advance Materials Corporation uses nanostructured films to improve the corrosion and scratch resistance of electrical contact pads. Claim 1 reads:
1. A pad structure, comprising:
a copper trace pattern on a substrate;
a nickel layer stacked on the copper trace pattern;
a gold layer stacked on the nickel layer; and
a nano-structured coating film stacked on the gold layer, wherein the nano-structured coating film infiltrates surface grain boundary of the gold layer.
This patent from Advance Materials Corporation uses nanostructured films to improve the corrosion and scratch resistance of electrical contact pads. Claim 1 reads:
1. A pad structure, comprising:
a copper trace pattern on a substrate;
a nickel layer stacked on the copper trace pattern;
a gold layer stacked on the nickel layer; and
a nano-structured coating film stacked on the gold layer, wherein the nano-structured coating film infiltrates surface grain boundary of the gold layer.
Labels: Advance Materials Corporation
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