Tuesday, January 24, 2012

US Patent 8100314 - CNT solder


Electromigration is the transport of material due to ion drift and can be damaging to solder at high current densities. This patent from Intel teaches using carbon nanotubes to form a solder in which electromigration problems are reduced. Claim 1 reads:

1. A bump comprising:

a solder paste comprising solder powder and a paste ingredient mixed with the solder powder; and

carbon nanotubes (CNTs) dispersed within the solder paste with a pre-defined volume fraction, wherein the pre-defined volume fraction ranges from approximately 30% to 40%, to provide high electrical conductivity;

wherein the solder paste is attached to at least one of a die or a package substrate.