Thursday, June 23, 2011

US Patent 7964447 - CNT thermal interface

This patent from Intel teaches the fabrication of a thermal interconnect between IC packages and heat spreaders using carbon nanotube arrays. Claim 1 reads:

1. A process comprising:

growing a first carbon nanotube (CNT) array on a first substrate in a first pattern;

growing a second CNT array on a second substrate in a second pattern that is geometrically complementary to the first pattern; and

assembling the first CNT array and the second CNT array such that the first substrate and the second substrate are joined at the first CNT array and the second CNT array.