Tuesday, February 15, 2011

US Patent 7886813 - Thermal interface with CNTs and particles


Intel continues to focus their carbon nanotube patents on new type of thermal cooling materials. This latest patent combines carbon nanotubes with metallic particles to create a composite material used to dissipate heat in high performance ICs. Claim 1 reads:

1. A thermal conducting material comprising:

a matrix material;

a distribution of separate particles within the matrix material, at least one particle including:

a heat conducting particle; and

a carbon nanotube structure attached at only one end to a surface of the heat conducting particle, and configured to remain attached at the same attachment location on the heat conducting particle during spreading of the thermal conducting material.