US Patent 7886813 - Thermal interface with CNTs and particles

http://www.freepatentsonline.com/7886813.html

Intel continues to focus their carbon nanotube patents on new type of thermal cooling materials. This latest patent combines carbon nanotubes with metallic particles to create a composite material used to dissipate heat in high performance ICs. Claim 1 reads:

1. A thermal conducting material comprising:

a matrix material;

a distribution of separate particles within the matrix material, at least one particle including:

a heat conducting particle; and

a carbon nanotube structure attached at only one end to a surface of the heat conducting particle, and configured to remain attached at the same attachment location on the heat conducting particle during spreading of the thermal conducting material.