Thursday, September 23, 2010

US Patent 7799849 - Self-healing nanomaterial

This patent from Intel is related to semiconductor packaging and teaches a material to heal cracks in the packaging using an encapsulated nanoparticle composite. Claim 1 reads:

1. A method to fabricate a self-healing material comprising:

mixing nanoscale material with a healing agent to form a healing mixture;

encapsulating the healing mixture to form a plurality of self-healing capsules; and

dispersing the self-healing capsules in a polymer to fabricate the self-healing material.