US Patent 7799425 - Metal composite nanoparticle
http://ip.com/patent/US7799425
This patent from Ebara Corporation teaches a nanostructured bonding material as a substitute for solder in microelectronics. Claim 1 reads:
1. A composite nanoparticle comprising:
a core comprising an inorganic metal compound and a metal component; and
a coating of an organic substance bonded to said core by physical adsorption.
This patent from Ebara Corporation teaches a nanostructured bonding material as a substitute for solder in microelectronics. Claim 1 reads:
1. A composite nanoparticle comprising:
a core comprising an inorganic metal compound and a metal component; and
a coating of an organic substance bonded to said core by physical adsorption.
Labels: Ebara Corporation
posted by blaisemouttet at 8:13 PM
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