Wednesday, September 22, 2010

US Patent 7799425 - Metal composite nanoparticle

This patent from Ebara Corporation teaches a nanostructured bonding material as a substitute for solder in microelectronics. Claim 1 reads:

1. A composite nanoparticle comprising:

a core comprising an inorganic metal compound and a metal component; and

a coating of an organic substance bonded to said core by physical adsorption.