US Patent 7763362 - Metallic nanoparticle shielding
http://www.freepatentsonline.com/7763362.html
This patent is from a company called PChem Associates and teaches a printed circuit shielding film for EMI interference based on metal nanoparticles. The film can be applied to a wider variety of substrates than conventional electronic shielding films due to less harsh processing methods and might be suitable for plastic or flexible electronic substrates. Claim 1 reads:
1. A cohesive metallic shielding structure, comprising:
a population of metallic nanoparticles, deposited on a substrate and sintered to form a cohesive metallic shielding structure,
wherein the cohesive metallic shielding structure has a characteristic thickness of less than about 20 micrometers; and
wherein the cohesive metallic shielding structure has a sheet resistance less than about 50 mohms/square/mil.
This patent is from a company called PChem Associates and teaches a printed circuit shielding film for EMI interference based on metal nanoparticles. The film can be applied to a wider variety of substrates than conventional electronic shielding films due to less harsh processing methods and might be suitable for plastic or flexible electronic substrates. Claim 1 reads:
1. A cohesive metallic shielding structure, comprising:
a population of metallic nanoparticles, deposited on a substrate and sintered to form a cohesive metallic shielding structure,
wherein the cohesive metallic shielding structure has a characteristic thickness of less than about 20 micrometers; and
wherein the cohesive metallic shielding structure has a sheet resistance less than about 50 mohms/square/mil.
Labels: PChem Associates
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