Thursday, July 22, 2010

US Patent 7759780 - Microelectronic package with nanomaterial wear resistant coating

In order to improve the scratch and abrasion resistance of IC packaging this patent from Intel teaches using a variety of nanomaterial films as protective coatings. Claim 1 reads:

1. A microelectronic package, comprising:

a semiconductor substrate;

a die having a top surface and a bottom surface, wherein the bottom surface of the die is coupled to the semiconductor substrate; and

a nanomaterial layer disposed on the top surface of the die, wherein the nanomaterial layer comprises a resin having a nanofiller disposed within the resin,

wherein the nanomaterial layer comprises a scratch and abrasion resistant material, and wherein a weight percentage of the nanofiller in the nanomaterial layer is between about 1% to about 60%.