US Patent 7759780 - Microelectronic package with nanomaterial wear resistant coating
http://www.freepatentsonline.com/7759780.html
In order to improve the scratch and abrasion resistance of IC packaging this patent from Intel teaches using a variety of nanomaterial films as protective coatings. Claim 1 reads:
1. A microelectronic package, comprising:
a semiconductor substrate;
a die having a top surface and a bottom surface, wherein the bottom surface of the die is coupled to the semiconductor substrate; and
a nanomaterial layer disposed on the top surface of the die, wherein the nanomaterial layer comprises a resin having a nanofiller disposed within the resin,
wherein the nanomaterial layer comprises a scratch and abrasion resistant material, and wherein a weight percentage of the nanofiller in the nanomaterial layer is between about 1% to about 60%.
In order to improve the scratch and abrasion resistance of IC packaging this patent from Intel teaches using a variety of nanomaterial films as protective coatings. Claim 1 reads:
1. A microelectronic package, comprising:
a semiconductor substrate;
a die having a top surface and a bottom surface, wherein the bottom surface of the die is coupled to the semiconductor substrate; and
a nanomaterial layer disposed on the top surface of the die, wherein the nanomaterial layer comprises a resin having a nanofiller disposed within the resin,
wherein the nanomaterial layer comprises a scratch and abrasion resistant material, and wherein a weight percentage of the nanofiller in the nanomaterial layer is between about 1% to about 60%.
Labels: Intel
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