Wednesday, July 21, 2010

US Patent 7758912 - Anti-stiction bump coating for MEMS

Micromirrors are used in digital displays and interferometers and often include a spacing member or bump used to regulate the position of a microcantilever. One problem of such microsystems is stiction in which the movable members become stuck to the bumps. This patent from HP teaches a deposition method for anti-stiction on the bumps. Claim 1 reads:

1. A process of manufacturing microelectronic devices, comprising:

placing a wafer in a deposition chamber, said wafer comprising a number of microelectronic devices, said microelectronic devices comprising a number of bump regions, said bump regions comprising a dielectric material; and

depositing an anti-stiction coating only on said bump regions, in which said anti-stiction coating is configured to react with said dielectric material of said bump regions.