US Patent 7732918 - Vapor chamber heat sink with CNT fluid interface

http://www.freepatentsonline.com/7732918.html

This patent from Nanoconduction takes advantage of the high surface area of carbon nanotube arrays to improve the efficiency of vapor cooling chambers. Claim 1 reads:

1. A thermal transposer, comprising:

a substrate;

a plurality of carbon nanotubes individually grown on a first surface of said substrate in an orientation that is substantially parallel to a desired heat transfer axis of said thermal transposer;

an encapsulating structure attached to said substrate together forming a sealed vapor chamber, wherein said carbon nanotubes are located inside of said sealed vapor chamber; and,

a vapor fluid contained within said vapor chamber.