Monday, June 14, 2010

US Patent 7732918 - Vapor chamber heat sink with CNT fluid interface

This patent from Nanoconduction takes advantage of the high surface area of carbon nanotube arrays to improve the efficiency of vapor cooling chambers. Claim 1 reads:

1. A thermal transposer, comprising:

a substrate;

a plurality of carbon nanotubes individually grown on a first surface of said substrate in an orientation that is substantially parallel to a desired heat transfer axis of said thermal transposer;

an encapsulating structure attached to said substrate together forming a sealed vapor chamber, wherein said carbon nanotubes are located inside of said sealed vapor chamber; and,

a vapor fluid contained within said vapor chamber.