Thursday, March 11, 2010

US Patent 7675163 - Semiconductor housing including CNT cooling

A variety of companies such as Intel (US Patent 7335983) and Hon Hai Precision (US Patent 7303001) have proposed systems using carbon nanotubes to assist in cooling semiconductor packages. This latest variation is from Sun Microsystems and uses a fluid flow to assist thermal transport. Claim 1 reads:

1. A system for cooling a semiconductor device, comprising:

a lid encasing the semiconductor device;

a first plurality of carbon nanotubes disposed within the lid; and

a fluid system configured to pass a fluid through the lid.