Sunday, October 18, 2009

US Patent 7602614 - Nanoparticle interconnect lines within electronic module

This patent from Infineon teaches a way to form wiring connections within the body of a plastic circuit board carrier using nanoparticles. Claim 1 reads:

1. An electronic module comprising:

a first and a second component with connections on connection sides of the components;

a wiring block made of plastic with contact pads on its outer sides and with lines comprising nanoparticles with carbonized short-circuit paths between the nanoparticles in its volume, the lines electrically connecting the contact pads on the outer sides to one another according to a circuit layout, the first component and the second component being arranged on different non-opposite outer sides of the wiring block and the connections being connected to the contact pads.