Tuesday, October 13, 2009

US Patent 7600667 - CNT reinforced solder caps


In order to deal with increased heat stresses in IC solder connections this patent from Intel teaches the incorporation of carbon nanotubes in a solder. Claim 1 reads:

1. A process comprising:

thermo compression transfer bonding a carbon nanotube-solder (CNT-S) composite particle from a transfer substrate to a solder bump.