Thursday, May 22, 2008

US Patent 7375417 - Nanoceramic heat sink for IC package

This patent from independent inventor Bao Tran teaches incorporating carbon nanomaterials into a ceramic host material to create an efficient heat sink for IC cooling. Claim 1 reads:

1. A package for an integrated circuit, comprising:

a chip having a plurality of nodes adapted to receive signals from or to output signals to an external circuit; and

a frame having a plurality of contact points each coupled to one node of the chip; and

a nano ceramic material in thermal communication with the chip for removing heat from the chip.