US Patent 7317257 - Inhibiting underfill flow using nanoparticles
http://www.freepatentsonline.com/7317257.html
Adhesive material is used to fill cracks in IC during manufacture by capillary action but if too much adhesive is provided it may flow to undesirable areas. This patent from Intel teaches the use of nanoparticles in a barrier to prevent flow of the adhesive outside of a desirable area.
1. An apparatus, comprising: a substrate; a component disposed adjacent to the substrate; a plurality of nanoparticles disposed adjacent to the substrate and proximate to at least a first side of the component; the nanoparticles each having an outer surface, the outer surface having a characteristic of being substantially immiscible with a flowable adhesive material.
Adhesive material is used to fill cracks in IC during manufacture by capillary action but if too much adhesive is provided it may flow to undesirable areas. This patent from Intel teaches the use of nanoparticles in a barrier to prevent flow of the adhesive outside of a desirable area.
1. An apparatus, comprising: a substrate; a component disposed adjacent to the substrate; a plurality of nanoparticles disposed adjacent to the substrate and proximate to at least a first side of the component; the nanoparticles each having an outer surface, the outer surface having a characteristic of being substantially immiscible with a flowable adhesive material.
Labels: Intel
posted by blaisemouttet at 5:12 PM
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