Monday, April 30, 2012

US Patent 8164000 - Flexible PCB including CNT heat sink

This patent from Zhen Ding Technology Co., Ltd. deals with the problem of thermal dissipation in multilayer flexible PCBs by using carbon nanotube arrays. Claim 1 reads:

1. A flexible printed circuit board, comprising:

a flexible printed circuit board base film comprising:

 a sheet of flexible polymer matrix comprising a first surface and an opposite second surface, and a carbon nanotube array comprising a plurality of carbon nanotube bundles embedded in the sheet of flexible polymer matrix,

wherein a distribution density of the carbon nanotubes bundles gradually decreases in a given direction perpendicular to a thickness direction of the sheet of the flexible polymer matrix, and electrically conductive traces formed on the flexible printed circuit board base film.