US Patent 8164000 - Flexible PCB including CNT heat sink

http://www.freepatentsonline.com/8164000.html

This patent from Zhen Ding Technology Co., Ltd. deals with the problem of thermal dissipation in multilayer flexible PCBs by using carbon nanotube arrays. Claim 1 reads:

1. A flexible printed circuit board, comprising:

a flexible printed circuit board base film comprising:

 a sheet of flexible polymer matrix comprising a first surface and an opposite second surface, and a carbon nanotube array comprising a plurality of carbon nanotube bundles embedded in the sheet of flexible polymer matrix,

wherein a distribution density of the carbon nanotubes bundles gradually decreases in a given direction perpendicular to a thickness direction of the sheet of the flexible polymer matrix, and electrically conductive traces formed on the flexible printed circuit board base film.