US Patent 8004076 - CNT interconnect for microelectronic package

http://www.freepatentsonline.com/8004076.html

This patent from Intel teaches a way to deal with the problem of stress caused by thermal expansion in semiconductor packaging by using carbon nanotube interconnects. Claim 1 reads:

1. A method of forming a microelectronic package, comprising:

providing a silicon substrate having a plurality of carbon nanotubes disposed on a silicon layer;

coupling the silicon substrate to a top surface of a packaging substrate, wherein the plurality of carbon nanotubes are coupled to a plurality of substrate pads of the packaging substrate;

removing the silicon substrate from the packaging substrate; and

disposing a die adjacent to the top surface of the packaging substrate, wherein the plurality of carbon nanotubes are coupled to a plurality of bump pads of the die.