Tuesday, August 23, 2011

US Patent 8003173 - Forming photoresist laminate with nanoparticle aerosol


This patent from Samsung teaches how to improve the adhesion of photoresist layers used in PCB fabrication by using aerosol deposition of metal nanoparticles. Claim 1 reads:

1. A method for forming a photoresist-laminated substrate comprising:

preparing a laminated substrate having an insulating substrate and a metal layer;

coating with an aerosol of metal nanoparticles having a diameter of 0.001 to 10 μm on the metal layer, wherein a pitch between the metal nanoparticles in the aerosol is 0.001 to 20 μm;

laminating a photoresist film on the metal layer coated with the aerosol of metal nanoparticles.