US Patent 8003173 - Forming photoresist laminate with nanoparticle aerosol

http://www.freepatentsonline.com/8003173.html

This patent from Samsung teaches how to improve the adhesion of photoresist layers used in PCB fabrication by using aerosol deposition of metal nanoparticles. Claim 1 reads:

1. A method for forming a photoresist-laminated substrate comprising:

preparing a laminated substrate having an insulating substrate and a metal layer;

coating with an aerosol of metal nanoparticles having a diameter of 0.001 to 10 μm on the metal layer, wherein a pitch between the metal nanoparticles in the aerosol is 0.001 to 20 μm;

laminating a photoresist film on the metal layer coated with the aerosol of metal nanoparticles.