Friday, July 02, 2010

US Patent 7745101 - Nanoparticle liftoff patterning

Lift-off is a process used in microfabrication involving the additive patterning of thin films. This patent from Eastman Kodak teaches a similar method for patterning metal nanoparticles. Claim 1 reads:

1. A method of making a metallic pattern comprising:

depositing a layer of photoresist on a substrate;

forming a pattern of opening in said photoresist;

depositing a layer of metal nanoparticles on said photoresist and on said pattern;

removing said photoresist and overlying metal nanoparticles on said photoresist; and

sintering the remaining said nanoparticles to form a metallic pattern.