US Patent 7745101 - Nanoparticle liftoff patterning
http://www.freepatentsonline.com/7745101.html
Lift-off is a process used in microfabrication involving the additive patterning of thin films. This patent from Eastman Kodak teaches a similar method for patterning metal nanoparticles. Claim 1 reads:
1. A method of making a metallic pattern comprising:
depositing a layer of photoresist on a substrate;
forming a pattern of opening in said photoresist;
depositing a layer of metal nanoparticles on said photoresist and on said pattern;
removing said photoresist and overlying metal nanoparticles on said photoresist; and
sintering the remaining said nanoparticles to form a metallic pattern.
Lift-off is a process used in microfabrication involving the additive patterning of thin films. This patent from Eastman Kodak teaches a similar method for patterning metal nanoparticles. Claim 1 reads:
1. A method of making a metallic pattern comprising:
depositing a layer of photoresist on a substrate;
forming a pattern of opening in said photoresist;
depositing a layer of metal nanoparticles on said photoresist and on said pattern;
removing said photoresist and overlying metal nanoparticles on said photoresist; and
sintering the remaining said nanoparticles to form a metallic pattern.
Labels: Eastman Kodak
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