Thursday, July 01, 2010

US Patent 7744947 - Method of forming CNT metallic wires

This patent from Korea Advanced Institute of Science and Technology teaches a way to form metallic wiring on a semiconductor substrate using carbon nanotubes coated in recesses imprinted on the substrate.

1. A method of forming carbon nanotubes on a substrate, comprising:

(a) patterning a mold on an upper surface of the substrate to form a recess;

(b) coating carbon nanotubes on an upper surface of the recess and an upper surface of the mold;

(c) filling the carbon nanotubes that are coated on the upper surface of the mold in the recess by using a flattening tool; and

(d) removing the mold.