US Patent 7615476 - Nanoparticle paste soldering

http://www.freepatentsonline.com/7615476.html

This patent from Intel teaches the use of nanoparticles to reduce thermal stress in soldering processes. Claim 1 reads:

1. A process comprising:

forming a nano-particle solder paste on a substrate;

contacting the nano-particle solder paste with a wire interconnect; and

reflowing the nano-particle solder paste to form a solder bump in a wire interconnect article.