Tuesday, August 25, 2009

US Patent 7578909 - CNT sputtering apparatus


Sputtering is a common technique used in the semiconductor industry in forming metal or metal oxide thin film structures. This patent from Hitachi Cable teaches a way to integrate carbon nanotubes into the sputtering apparatus. Claim 10 reads:

10. A sputtering apparatus, comprising:

a sputtering target material, comprising: a molded material, comprising: a metal material; and a carbon nanotube (CNT) mixed into the metal material.