Wednesday, August 05, 2009

US Patent 7569410 - Integrated MEMS packaging

As microelectromechanical systems (MEMS) move into the mainstream one issue important to cost-savings is effective packaging and integration of MEMS devices with CMOS electronics. This patent from Sharp teaches a way to fabricate MEMS on glass substrates making it easier to integrate MEMS devices in cell phones to achieve image and motion capture functions.
Claim 1 reads:

1. A method for packaging a microelectromechanical system (MEMS) device, the method comprising:

providing a first substrate having a first region with boundaries;

forming an electrical circuit on a second region of the first substrate, electrically connected to the first substrate;

integrating a MEMS device on the first region, electrically connected to the first substrate;

providing a second substrate overlying the first substrate; and,

forming a wall along the first region boundaries, between the first and second substrates, hermetically enclosing the MEMS device.