US Patent 7520742 - Nanoimprint mold-releasing agent
US Patent 7520742
Nanoimprint lithography provides a technique to mechanically pattern structures on the nanometer scale using surface contours of a mold structure. However, one difficulty is in the release of the mold from the material being patterned without deforming the structures being formed. This patent from Hitachi teaches a mold structure including a release agent to solve this problem. Claim 1 reads:
1. A nanoprinting mold for forming a fine structure on a resin substrate or on a resin film on a substrate using a press machine, wherein said mold has a concave-convex pattern including a plurality of concave portions and convex portions, and a mold-releasing agent is provided only on top surfaces of said convex portions of said mold, and wherein said mold-releasing agent is a solid and has a coefficient of friction smaller than that of said concave portions.
Nanoimprint lithography provides a technique to mechanically pattern structures on the nanometer scale using surface contours of a mold structure. However, one difficulty is in the release of the mold from the material being patterned without deforming the structures being formed. This patent from Hitachi teaches a mold structure including a release agent to solve this problem. Claim 1 reads:
1. A nanoprinting mold for forming a fine structure on a resin substrate or on a resin film on a substrate using a press machine, wherein said mold has a concave-convex pattern including a plurality of concave portions and convex portions, and a mold-releasing agent is provided only on top surfaces of said convex portions of said mold, and wherein said mold-releasing agent is a solid and has a coefficient of friction smaller than that of said concave portions.
Labels: Hitachi
posted by blaisemouttet at 2:49 PM
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