US Patent 7335983 - CNT microchimney for IC cooling
http://www.freepatentsonline.com/7335983.html
As more and more circuits are crammed into smaller and smaller spaces for processor designs heat generation is becoming a dominating issue. This patent from Intel uses carbon nanotubes which are whimsically referred to as "micro-chimneys" to facilitate heat removal from ICs. Claim 1 reads:
1. A semiconductor package comprising: a die, including an integrated circuit, formed of a bulk material further forming a cavity; a plurality of carbon nanotubes disposed within the cavity and coupled to the die near a region heated by the integrated circuit; and a plurality of plates, wherein the plurality of carbon nanotubes is divided into a plurality of groups according to carbon nanotube length, each group corresponding to one plate coupled to one or more carbon nanotubes of the group.
As more and more circuits are crammed into smaller and smaller spaces for processor designs heat generation is becoming a dominating issue. This patent from Intel uses carbon nanotubes which are whimsically referred to as "micro-chimneys" to facilitate heat removal from ICs. Claim 1 reads:
1. A semiconductor package comprising: a die, including an integrated circuit, formed of a bulk material further forming a cavity; a plurality of carbon nanotubes disposed within the cavity and coupled to the die near a region heated by the integrated circuit; and a plurality of plates, wherein the plurality of carbon nanotubes is divided into a plurality of groups according to carbon nanotube length, each group corresponding to one plate coupled to one or more carbon nanotubes of the group.
Labels: Intel
<< Home