Tuesday, November 27, 2007

US Patent 7300860 - Nanotube IC formed using spin coating


This patent from Intel teaches a process for incorporating carbon nanotubes into the fabrication processes for integrated circuits. Claim 1 reads:

1. A method of fabricating an integrated circuit comprising: forming or providing a solution containing metal ions and carbon nanotubes; and co-depositing the metal ions and carbon nanotubes onto a substrate utilizing the solution to form a metal layer, said co-depositing including spin-coating onto the substrate at a rotation speed of between about 20 and about 100 rpm for a time of between about 1 and about 5 minutes and annealing the substrate at a temperature of between about 200 and about 500.degree. C. for a time of between about 1 and about 200 minutes.