Wednesday, September 19, 2007

US Patent 7272010 - Heat dissipation using carbon nanotube circuit board

This patent from Advanced Micro Devices presents some basic claims to carbon nanotubes used for thermal dissipation. Apparently the point of novelty is that the nanotubes are dispersed in a binding matrix rather than bundled together. Claim 1 reads:

1. A circuit board, comprising: a substrate including a source material interspersed and in physical contact with a first plurality of unbundled carbon nanotubes; and at least one conductor coupled to the substrate.

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