US Patent 7272010 - Heat dissipation using carbon nanotube circuit board

http://www.freepatentsonline.com/7272010.html

This patent from Advanced Micro Devices presents some basic claims to carbon nanotubes used for thermal dissipation. Apparently the point of novelty is that the nanotubes are dispersed in a binding matrix rather than bundled together. Claim 1 reads:

1. A circuit board, comprising: a substrate including a source material interspersed and in physical contact with a first plurality of unbundled carbon nanotubes; and at least one conductor coupled to the substrate.