Thursday, September 13, 2007

US Patent 7268423 - Carbon nanotubes for rewiring plate

When connecting a semiconductor chip to a circuit board differing thermal expansion effects can cause mechanical problems. In order to overcome this difficulty a rewiring plate is often used as a buffer. This patent from Infineon teaches the incorporation of carbon nanotubes in such rewiring plates to increase connection density. Claim 1 reads:

1. A rewiring plate for components with a dense connection grid, the rewiring plate comprising: a base body having passages and including silicone; and a plurality of carbon nanotubes positioned within the passages, a lower end of the passages opening out into contact connection surfaces, wherein the carbon nanotubes form an electrically conductive connection from the contact connection surfaces to a front surface of the base body.

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