US Patent 7229847 - Electrode-molecule interconnects using imprint stamp

http://www.freepatentsonline.com/7229847.html

A variety of techniques have been used to form interconnects between molecular structures and electrodes but many of these techniques result in shorts that can decrease the effectiveness of a molecular junction. This patent from Lucent teaches use of an imprint stamp to form electrodes for molecular interconnects to help alleviate shorting defects caused when an opposing electrode is deposited. Claim 1 reads:

1. A process for forming electrical contacts to a molecular layer comprising: coating raised and relief portions of a surface of a stamp with a metal layer; foaming an attached layer of anchored molecules by covalently bonding first ends of said anchored molecules to one of either a conductive or semiconductive substrate or said metal layer; and placing the other of said conductive or semiconductive substrate or said metal layer in contact with said attached layer of anchored molecules, said conductive or semiconductive substrate or said metal layer covalently bonding to free ends of said anchored molecules.