US Patent 7595708 - MEMS resonator array with shared beam sections

http://www.freepatentsonline.com/7595708.html

Micromechanical resonators are important to high frequency electronic devices used in communications applications. This patent from Robert Bosch GmbH teaches a MEMS array resonator having an improved resonator bandwidth (Q-factor) by using shared beam sections. Claim 1 reads:

1. A MEMS array structure, comprising:

a plurality of MEMS resonators forming an array,

each MEMS resonator including a plurality of beam sections,

wherein at least one of the beam sections is a shared beam section that is also included in another of the plurality of MEMS resonators which is adjacent to the respective MEMS resonator.

US Patent 7595539 - MEMS release using hydrogen gas

http://www.freepatentsonline.com/7595539.html

The moving parts of micromechanical structures typically need to be formed by a method including an etching steps which removes some underlying sacrificial layer material. Hydrofluoric acid is often used for this purpose but can be damaging and leave behind residue. This patent from Robert Bosch GmbH teaches an alternative using a hydrogen gas etchant. The claims seem to rely on a product-by-process justification of patentability which indicates that the process should produce a structurally differentiated MEMS device from prior MEMS devices released by other etchants (otherwise the claims would be invalid). Claim 1 reads:

1. A device including micromechanical elements, comprising:

a substrate layer;

a sacrificial layer on at least a first portion of the substrate layer; and

a function layer on at least a second portion of the sacrificial layer;

wherein the function layer is released from the substrate layer by exposing the device to gaseous hydrogen.

US Patent 7495328 - Micromechanical component with flow guide cap

http://www.freepatentsonline.com/7495328.html

For some micromechanical flow sensors turbulance can cause unpredictable measurements. This patent from Robert Bosch GmbH teaches a solution to this problem by forming a cap with a grooved surface to smooth the flow. Claim 1 reads:

1. A micromechanical component comprising:

a structure such that a material flow is guided from at least one preferred direction to uniformly envelop the micromechanical component; and

a cap affixed to the micromechanical component, wherein the cap has at least one structured surface having grooves running in a direction of the material flow to guide the material flow.

US Patent 7404332 - Porous silicon gettering for micromechanical sensor

http://www.freepatentsonline.com/7404332.html

Getter materials are often used to absorb contaminates and trace gases. This patent from Robert Bosch GmbH teaches a porous silicon gettering material more convenient for semiconductor based micromechanical structures. Claim 1 reads:

1. A micromechanical component for a sensor, comprising:

a body having a first substrate and a second substrate that form a hollow space; and

a region of porous silicon located contiguously thereto, wherein the region of porous silicon is provided for lowering a pressure prevailing in the hollow space, in that a gas is bound to the porous silicon.