Monday, June 06, 2011

US Patent 7952212 - Nanoparticle filler for IC packaging

IC packaging can suffer from delamination problems due to the high heat flux from microprocessors. This patent from Intel teaches concentrating nanoparticles in regions susceptible to delamination in order to provide a self-healing effect. Claim 1 reads:

1. An apparatus comprising:

a package including an integrated circuit, the package further including one or more regions of adjoining materials of different composition wherein one of the materials includes a polymeric material that includes a polymer matrix having at least one high energy region; and

a mobile nanoparticle filler dispersed substantially throughout the polymer matrix with an increased concentration in the high energy region.