Wednesday, July 07, 2010

US Patent 7748272 - Integrated MEMS sensor suite

This patent from Morgan Research Corporation teaches using a thick layer of SOI silicon to form the basis of three different types of MEMS sensors (accelerometer, thermal, humidity) leading to reduced packaging. Claim 1 reads:

1. A monolithically integrated micro-electromechanical sensor suite formed on a semiconductor chip, comprising:

a silicon-on-insulator accelerometer; and

a humidity sensor monolithically integrated with the silicon-on-insulator accelerometer,

wherein the silicon-on-insulator accelerometer and the humidity sensor are commonly fabricated from a shared active silicon layer.