Sunday, October 25, 2009

US Patent 7605466 - Adhesive sheet sealed MEMS package

The manufacture of micromechanical devices can be particularly susceptible to contamination from moisture and small particles which can cause sticking and obstruct movement in the microdevices. This patent from GE teaches a packaging process for pre-singulated MEMS dies using an adhesive sheet that avoids such contamination. Claim 1 reads:

1. A MEMS unit comprising:

a MEMS device on a substrate;

a cover;

an adhesive sheet comprising cutouts for the MEMS device;

the adhesive sheet disposed between the substrate and the cover;

standoff posts spanning between the substrate and the cover; and

the substrate, the adhesive sheet, and the cover bonded together in registration;

whereby the MEMS device is sealed and protected from contamination.