Wednesday, February 25, 2009

US Patent 7494907 - Fabrication of nanoparticle chain interconnect

This patent from Nanocluster Devices Limited teaches a method of bottom-up interconnect assembly via nanoparticle percolation. Claim 1 reads:

1. A method of forming at least a single conducting chain of nanoparticles between a number of contacts on a substrate comprising or including the steps of:

a. forming contacts separated by a distance smaller than 10 microns on the substrate,

b. preparing a plurality of nanoparticles, said nanoparticles being composed of two or more atoms of the same or different elements, of uniform or non-uniform size, and subsequently

c. directing a beam of the nanoparticles towards the substrate to randomly deposit a plurality of said nanoparticles on the substrate at least in the region between the contacts until the particles form at least one chain of nanoparticles between the contacts through which conduction consisting essentially of ohmic conduction can occur.