Wednesday, August 13, 2008

US Patent 7410597 - Thermally conductive material formed from nanotubes in supercritical fluid

CPU cooling as a growing problem as electronic circuit densities continue to increase. Often a cooling fluid is used to transport heat away from a processor and this patent from Hon Hai Precision teaches a variation of this type of cooling using a supercritical fluid incorporated with carbon nanotube to achieve a high thermal conductivity and fluidity. Claim 1 reads:

1. A thermally conductive material comprising:

a supercritical fluid configured for an evaporation-condensation cycle; and

a plurality of carbon nanotubes incorporated in the supercritical fluid, a percentage by mass of the carbon nanotubes relative to the thermally conductive material being in the range from 0.5% to 5%.