Wednesday, August 06, 2008

US Patent 7407704 - Nanoparticle-based bond joint for ease of separation

This patent from Henkel teaches the use of nanoparticles in a bonding adhesive that allows the bond to be more easily removed using electromagnetic fields. Claim 1 reads:

1. A separable bonded joint comprising an electromagnetically activatable primer layer and an adhesive layer adjacent to the primer layer, wherein the primer layer contains nanoscale particles with ferromagnetic, ferrimagnetic, superparamagnetic or piezoelectric properties.