US Patent 7370530 - 3-axis MEMS package

http://www.freepatentsonline.com/7370530.html

One of the most active applications of MEMS devices is in the area of inertial sensors such as gyroscopes and accelerometers. In some application more than one axis of motion needs to be monitored in which case multiple MEMS sensors may be required. This patent from Honeywell teaches a housing structure designed to minimize the size of such multi-dimensional inertial sensors. Claim 1 reads:

1. A package, comprising:

a packaging structure having a first sidewall, a second sidewall, and a third sidewall, joined to define an interior cavity, the packaging structure further having a planar top member coupled to a first end portion of the respective sidewalls and a bottom lid coupled to an opposite end portion of the respective sidewalls, the planar top member distally located from the bottom lid, the respective sidewalls, top member, and bottom lid cooperating to enclose the interior cavity;

a first MEMs device mounted within the interior cavity and on an inner wall surface on the first sidewall;

a second MEMs device mounted within the interior cavity and on an inner wall surface of the second sidewall; and

a third MEMs device mounted within the interior cavity and on an inner wall surface of the third sidewall.