Thursday, January 24, 2008

US Patent 7321714 - Nanoparticle material on IC package

This patent from ERS Company includes some very basic claims to a moisture resistant seal for integrated circuits formed from nanoparticle material. Claim 1 reads:

1. A packaged electronic device, comprising: a substrate with a first surface having an integrated circuit thereon; and a nano-particle material adjacent to the first surface.