US Patent 7250366 - Fabrication of metallized CNT bundle

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This patent from Intel teaches the fabrication of metallized carbon nanotube bundles of regulated length and diameter useful to form conductors. Claims 1 and 16 are representative:

1. A method comprising: forming an opening in a layer on a conductive layer of a substrate; forming a catalyst in the opening; fabricating a carbon nanotube bundle on the catalyst; removing material from the carbon nanotube bundle; and forming a metallization on the carbon nanotube bundle to form a metallized carbon nanotube bundle including the metallization and the catalyst.

16. A method comprising: flowing a solution including a metallized carbon nanotube bundle on a substrate including a trench to place the metallized carbon nanotube bundle into the trench; and forming a connection between the metallized carbon nanotube bundle and a via plug in the trench.