US Patent 7202552 - Flexible packaging for MEMS
http://www.freepatentsonline.com/7202552.html
The housings for MEMS devices have traditionally been formed from a limited number of materials including metals or ceramics. However, in order to take advantage of MEMS in diverse applications such as biotechnology and flexible electronics a wider variety of packaging is desired. This patent from Silicon Matrix discloses a polymer material substrate for a MEMS device. Claim 1 reads:
1. A MEMS package comprising: at least one MEMS device located on a flexible substrate; and a metal structure surrounding said at least one MEMS device wherein a bottom surface of said metal structure is attached to said flexible substrate and wherein said flexible substrate is folded over a top surface of said metal structure and attached to said top surface of said metal structure thereby forming said MEMS package.
The housings for MEMS devices have traditionally been formed from a limited number of materials including metals or ceramics. However, in order to take advantage of MEMS in diverse applications such as biotechnology and flexible electronics a wider variety of packaging is desired. This patent from Silicon Matrix discloses a polymer material substrate for a MEMS device. Claim 1 reads:
1. A MEMS package comprising: at least one MEMS device located on a flexible substrate; and a metal structure surrounding said at least one MEMS device wherein a bottom surface of said metal structure is attached to said flexible substrate and wherein said flexible substrate is folded over a top surface of said metal structure and attached to said top surface of said metal structure thereby forming said MEMS package.
Labels: MEMS
posted by blaisemouttet at 5:04 PM
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