Thursday, March 01, 2012

US Patent 8125075 - CNT micro-chimney for die level cooling

This patent from Intel is the latest in a series of patents teaching ways carbon nanotubes can be used in semiconductor packaging for cooling. Claim 1 reads:

1. A method of packaging a semiconductor comprising:

forming a cavity within a die near a region heated by an integrated circuit;

growing, within the cavity, a plurality of carbon nanotubes coupled to the die;

adding a saturated mixture of working fluid to the cavity; and

sealing the saturated mixture within the cavity.