Wednesday, April 27, 2011

US Patent 7931969 - Molecular fan for heat dissipation

Thermal conduction mechanisms such as heat sinks are most often used to cool electronics. However, thermal radiation can be a more efficient solution. This patent from Northern Illinois University teaches a molecular coating for facilitating radiative cooling. Claim 1 reads:

1. A molecular fan for dissipating heat, said fan comprising a chemically functionalized molecular fan thin film coating with a thickness of 1-10 μm affixed to a heat sink surface in need of heat dissipation, said molecular fan thin film coating comprising an emulsion, nanoparticles, and functionalized nanomaterials capable of assembling active vibrational groups that emit infrared radiation within said coating, and made using hazardous air pollutants-free (HAPs-free) co-solvents.