Thursday, March 25, 2010

US Patent 7682652 - Nanoparticle circuit line formation

Inkjet processes are being examined to develop additive patterning of nanomaterials but can suffer from weak bonding power between the base substrate and the nanomaterials. This patent from Samsung teaches a solution to this problem using an alkali surface treatment. Claim 1 reads:

1. A method for forming circuit lines on a substrate comprising the steps of:

(a) selectively applying a surface treatment solution which includes an alkali metal compound on a base film in accordance with circuit patterns by a discharging method;

(b) applying a conductive ink which includes metal nanoparticles in accordance with the surface-treated circuit pattern; and

(c) curing the base film on which the conductive ink is applied under a reduction atmosphere.