Monday, February 22, 2010

US Patent 7663226 - CNT solder resist

This patent from Samsung teaches increasing the thermal conductivity of solder used in PCBs by incorporating carbon nanotubes. Claim 5 reads:

5. A semiconductor chip package comprising:

a semiconductor chip;

an insulation layer configured to have the semiconductor chip mounted thereon and having a circuit pattern formed on a surface thereof; and

a solder resist stacked on the insulation layer, wherein the solder resist contains carbon nanotubes.

One relevant prior art patent which appears to have been overlooked is from Intel.

US Patent 7180174 - Nanotube modified solder thermal intermediate structure, systems, and methods (title)